The power to connect that Hioki’s printed circuit board testing systems deliver is the power to connect to the future. The ability to continue to support this rich and satisfying lifestyle together with customers is a small part of what testing systems can do. At Hioki, we strive on a daily basis to improve the contact performance–the power to connect with circuit boards–that is the lifeblood of electrical testing and to seek out the true potential of that capability. This is the path that we follow.

• Optimization of probe movement reduces inspection time by up to 20% • Reduce probe marks in combination with the latest probes • Fault analysis using newly developed “Process Analyzer”

• Achieves square 15 μm high precision contacts and high speed probing • Max.100 points/s ultra-high speed inspection • Inspection is possible from general bare board to fine and high density substrates such as flexible substrate and CSP. • In addition to capacitance measurement, measurement functions for component built-in boards such as diodes are also complete

• Slide-in mechanism simplifies installation and removal of test fixtures, reducing man-hours and workload. • Extension range of options that reduces setup man-hours and boosts productivity. • Numerous measurement parameters and detecting defects for a wide variety of inspections. • Productivity, quality, and safety. • Data creation support functionality: ATG function.

• Functionality has been consolidated in a single, desktop tower that can be easily embedded in existing equipment • Extensive function testing • Electrolytic capacitor and IC reverse insertion detection • Macro-testing function to increase test efficiency • Four-terminal low-resistance measurement for stable measurement of low resistance

• Quickly complete programs that take into account component height • Automatically calculate arm interference (when used with the UA1780) • Designed to improve probe replaceability, dramatically reducing system downtime caused by probe replacement • High-speed testing at up to 0.025 sec./step • Detect IC lead float and pseudo-contact states • Support for active testing (optional feature) • High-precision probing • Large testing area of 510 × 460 mm (FA1240-61) • Standard transport capability • Automatic alignment function and simple visual test function CE Compliant model: FA1241-61

• Perform statistical analysis using the latest AI technologies • Detect significant points that can cause latent defects • Provide feedback to improve quality in board production and design processes

• Visualize test results from flying-probe testers • Pinpoint components and patterns from test result files • Display the probing positions of test fixtures or test heads for both ICT and bare board testers • Search for components and nets on device embedded substrates